Products
- World's first automation in wafer scale, fully automated imprinting process, wafer load/unload, coating, imprinting
- Mass production through automation: minimizes error and contamination
- CoC reduction through mold that withstands repetitive use
- Low investment and maintenance cost via throughput in contrast to stepper(CoO)
- Makes nanometered ultra-micro patterns and micrometered micro-patterns
- We have secured air void defectiveness prevention and high pattern reproduction rate in hole, pillar, wall, and trench patterns
- We have obtained production capability which readily manufactures patterns not feasible with 3D lens, lenticular and other general photo process
- Applicable in various substrate type(glass, wafer, film)
- Applicable in various substrate size(4-inch ~ 8-inch)
- World's best capacity in controlling remaining film thickness: fabrication and reproduction of wafer-scale uniform film thickness
Imprinting Process |
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Equipment Components | |
Full Automated Imprinter |
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Mold Imprinter |
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Auto Imprinter |
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Manual Imprinter |
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Gigalane NANO-IMPRINTER |
CITUS 6000FA |
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Fully automatic Imprinter | |
Overview & Performance |
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Gigalane NANO-IMPRINTER |
CITUS 6000M for Mold | CITUS 6000R | CITUS 6000SA |
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Mold Imprinter | Auto Imprinter | Manual Imprinter | |
Overview |
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Performance |
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Nano pattern : WGP |
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Nano pattern : pillar array |
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Micro pattern : hole array |
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Micro lens array : Si wafer |
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Micro trench line | ![]() |
Various imprinted patterns |
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