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Semiconductor & MEMS

在因机器人、物联网、生物领域、智能车等第四次工业革命而备受瞩目的产业领域中,数据储存和处理变得愈发重要,因此负责这些数据的半导体性能的提高和特殊的半导体技术将成为重要因素。 为使数据的存储、处理及驱动仅通过一个CHIP一元化,需要将MEMORY、LOGIC以及MEMS SENSOR等一体化连接的、从NANO到MICRO的图案技术。

Related Products
Deep Si Etcher
  • - 6inch-12inch Deep Silicon Etcher
  • - Shallow & Deep Si Trench, TSV(Through Si Via), Si Thinning & Sawing
  • - Cycle & non-Cycle Process available
Performance
  • - aspect Ratio. ~ 60:1
  • - Uniformity, < ±5%
  • - Metal Contamination 5X1010ea/cm2
  • - Damage-free, HF/LF Dual Bias (HF Bias Optional)
  • - Surface Roughness, min. 3nm
  • - Undercut-free, Notching-free
  • - Loading Effect Control
Applied Device and Process Capability
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